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Engineering Standard
- Primers
- Conformal Coatings
- Ice-phobic Coatings
- Adhesives and Sealants
- Glob Top
- Potting and
  Encapsulating Materials
- Potting & Encapsulation for all Electronics New
- Silicone Foams
- HCR Fluoro
  Silicone Elastomer
- Electrically Conductive
  Materials
- LSR Elastomers
- Thermally Conductive
  Materials
- Fluorosilicone Adhesive
  and Sealant
- Silicone Inks
- Silicone Resins
- Moulding Materials
- Dampening Fluids
  and Lubricants
- Greases
- Potting and
  Encapsulating Gels
Engineering Controlled
Engineering Space
Thermally Stable
High temperate silicones

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Potting and Encapsulating Materials for Electronics

Engineering Materials - Selection Guide
General Purpose - Engineering Standard Silicone Potting and Encapsulation for Electronics

NuSil ID	Cure System	Work Time	Mix Ratio	Comments
R-2165	Platinum	10 M	1:1	Enhanced thermal conductivity for removal of heat and improved reliability
R-2175	Platinum	1 H	1:1	Thermally conductive silicone potting elastomer cures at room temperature
R-2188	Platinum	8 HR +	1:1	Pourable and self-leveling Cures at lower temperatures (≥70°C)
R-2613		2 HR	10:1	Pourable and self-leveling Cures at room temperature

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